精選計算機英語高級詞彙·CPU
3D Now(3D no waiting)
ALU(Arithmetic Logic Unit,算術邏輯單元)
AGU(Address Generation Units,地址生成單元)
BGA(Ball Grid Array,球狀矩陣排列)
BHT(Branch Prediction Table,分支預測表)
BPU(Branch Processing Unit,分支處理單元)
Brach Pediction(分支預測)
CMOS(Complementary Metal Oxide Semiconductor,互補金屬氧化物半導體)
CISC(Complex Instruction Set Computing,複雜指令集計算機)
CLK(Clock Cycle,時鐘週期)
COB(Cache On Board,板上集成緩存)
COD(Cache On Die,芯片內集成緩存)
CPGA(Ceramic Pin Grid Array,陶瓷針型柵格陣列)
CPU(Center Processing Unit,中央處理器)
Data Forwarding(數據前送)
Decode(指令解碼)
DIB(Dual Independent Bus,雙獨立總線)
EC(Embedded Controller,嵌入式控制器)
Embedded Chips(嵌入式)
EPIC(Explicitly Parallel Instruction Code,並行指令代碼)
FADD(Floationg Point Addition,浮點加)
FCPGA(Flip Chip Pin Grid Array,反轉芯片針腳柵格陣列)
FDIV(Floationg Point Divide,浮點除)
FEMMS(Fast Entry/Exit Multimedia State,快速進入/退出多媒體狀態)
FFT(Fast Fourier Transform,快速熱歐姆轉換)
FID(Frequency Identify,頻率鑑別號碼)
FIFO(First Input First Output,先入先出隊列)
Flip-Chip(芯片反轉)
FLOP(Floating Point Operations Per Second,浮點操作/秒)
FMUL(Floationg Point Multiplication,浮點乘)
FPU(Float Point Unit,浮點運算單元)
FSUB(Floationg Point Subtraction,浮點減)
GVPP(Generic Visual Perception Processor,常規視覺處理器)
HL-PBGA(表面黏著高耐熱、輕薄型塑膠球狀矩陣封裝)
IA(Intel Architecture,英特爾架構)
ICU(Instruction Control Unit,指令控制單元)
ID(identify,鑑別號碼)
IDF(Intel Developer Forum,英特爾開發者論壇)
IEU(Integer Execution Units,整數執行單元)
IMM(Intel Mobile Module,英特爾移動模塊)
Instructions Cache(指令緩存)
Instruction Coloring(指令分類)
IPC(Instructions Per Clock Cycle,指令/時鐘週期)
ISA(instruction set architecture,指令集架構)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潛伏期)
LDT(Lightning Data Transport,閃電數據傳輸總線)
Local Interconnect(局域互連)
MESI(Modified,Exclusive,Shared,Invalid,修改、排除、共享、廢棄)
MMX(MultiMedia Extensions,多媒體擴展指令集)
MMU(Multimedia Unit,多媒體單元)
MFLOP
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